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RLX COMPONENTS s.r.o. , Electronic Components Distributor.
RLX COMPONENTS s.r.o. , Electronic Components Distributor.
SIM8262E-M2 SIMCom original 5G module, M.2 form factor, Qualcomm Snapdragon X62 (WS-23145)
WS-23145
€256.80
214.00 € tax excl.
SIM8262E-M2 SIMCom original 5G module, M.2 form factor, Qualcomm Snapdragon X62 (WS-23145)
SIM8262E-M2 SIMCom original 5G module, M.2 form factor, Qualcomm Snapdragon X62 (WS-23145)
SIM8262E-M2 SIMCom Original 5G Module, M.2 Form Factor, Qualcomm Snapdragon X62
SIM8262E-M2
SIMCom 5G Module Sub-6G Module Based On Qualcomm Snapdragon X62
Adopt 3GPP 5G Release 16
The SIM8262E-M2 is the Multi-Band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module which supports R16 5G NSA/SA up to 2.4Gbps data transfer.
It has strong extension capability with abundant interfaces including PCIe, USB3.1, GPIO etc. The module provides much flexibility and ease of integration for customer's applications.
The SIM8262E-M2 adopts M.2 form factor, and AT commands are compatible with the SIM7912G/SIM8200X-M2 series modules. This also minimizes the investments of customers and enables a short time-to-market.
It is designed for applications that need high throughput data communication in a variety of radio propagation conditions. Due to the unique combination of performance, security and flexibility, this module is ideally suited for many applications.
Product Advantages
- Standard M.2 interface.
- High throughput data communication.
- AT commands of the SIM8262E-M2 are compatible with SIM7912G/SIM8200X-M2 series modules
Specifications
| SIM8200EA-M2 | SIM8202G-M2 | SIM8262E-M2 | SIM8262A-M2 | |
|---|---|---|---|---|
| 5G STANDARD | 3GPP R15 | 3GPP R16 | ||
| CHIP | Qualcomm Snapdragon X55 | Qualcomm Snapdragon X62 | ||
| FREQUENCY BAND | ||||
| Sub-6G | n1, n2, n3, n5, n7, n8, n12, n20, n28, n38, n40, n41, n48, n66, n71, n78 | n1, n2, n3, n5, n7, n8, n12, n20, n28, n38, n40, n41, n66, n71, n77, n78, n79 | n1, n3, n5, n7, n8, n20, n28, n38, n40, n41, n77, n78,n79 | n2, n5, n7, n12, n13, n14, n25, n30, n41, n48, n66, n71, n77, n78, n79 |
| LTE-FDD | B1, B2, B3, B4, B5, B7, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B29, B30, B32, B66, B71 | B1, B3, B5, B7, B8, B18, B19, B20, B26, B28, B32 | B2, B4, B5, B7, B12, B13, B14, B25, B26, B29, B30, B66, B71 | |
| LTE-TDD | B34, B38, B39, B40, B41, B42, B43, B48 | B38, B39, B40, B41, B42, B43 | B41, B46, B48 | |
| WCDMA | B1, B2, B3, B4, B5, B8 | B1, B5, B8 | B2, B4, B5 | |
| GNSS | GPS, GLONASS, Beidou, Galileo, and QZSS | |||
| DATA RATE | ||||
| Sub-6G | 2.4 Gbps (DL) / 500 Mbps (UL) | |||
| LTE | 1 Gbps (DL) / 200 Mbps (UL) | |||
| HSPA+ | 42 Mbps (DL) / 5.76 Mbps (UL) | |||
| SOFTWARE FUNCTIONS | ||||
| Operating systems | Windows/Linux/Android | |||
| Communication protocols | TCP/IP, IPV4, IPV6, Multi-PDP, FTP, FTPS, HTTP, HTTPS, MQTTS, DNS, SSL3.0 | |||
| Dial Up | RNDIS、NDIS、PPP、MBIM | |||
| SMS | Supports MT, MO, CB, Text, PDU | |||
| Firmware upgrade | Supports firmware upgrade via USB port | |||
| HARDWARE SPECIFICATIONS | ||||
| SIM Card | 1.8V/2.95V | |||
| Antenna | For 3G/4G/5G/GNSS | |||
| 6 × IPEX-4 connectors | 4 × IPEX-4 connectors | |||
| Power Supply | 3.135~4.4V | |||
| Form Factor | M.2 | |||
| Dimensions | 52.0 × 30.0 × 2.3 mm | 42.0 × 30.0 × 2.3 mm | ||
| Operating Temperature | -30℃ ~ +70℃ | |||
| APPLICATIONS | ||||
| Applicable regions | China, US, Japan, South Korea, Europe, the Middle East, Latin America | except Americas | Americas | |
| The applicable regions above are for reference only, please choose the right module according to your local operator network coverage and supported frequency bands | ||||
| Application examples | CPE, Smart gateway, Drone, Live streaming, Remote medical treatment, Intelligent security | |||
WS-23145
Specific References
SIM8262E-M2 SIMCom original 5G module, M.2 form factor, Qualcomm Snapdragon X62 (WS-23145)
SIM8262E-M2 SIMCom original 5G module, M.2 form factor, Qualcomm Snapdragon X62 (WS-23145)
€256.80
214.00 € tax excl.