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    5G DONGLE Module, quad antennas, USB3.1 port, Aluminum Alloy Heatsink, M.2 Key B Interface (WS-23252)
    5G DONGLE Module, quad antennas, USB3.1 port, Aluminum Alloy Heatsink, M.2 Key B Interface (WS-23252)
    5G DONGLE Module, quad antennas, USB3.1 port, Aluminum Alloy Heatsink, M.2 Key B Interface (WS-23252)
    5G DONGLE Module, quad antennas, USB3.1 port, Aluminum Alloy Heatsink, M.2 Key B Interface (WS-23252)
    5G DONGLE Module, quad antennas, USB3.1 port, Aluminum Alloy Heatsink, M.2 Key B Interface (WS-23252)

    5G DONGLE Module, quad antennas, USB3.1 port, Aluminum Alloy Heatsink, M.2 Key B Interface (WS-23252)

    WS-23252

    5G DONGLE Module, quad antennas, USB3.1 port, Aluminum Alloy Heatsink, M.2 Key B Interface (WS-23252)

    Quantity :

    5G DONGLE Module, quad antennas, USB3.1 port, Aluminum Alloy Heatsink, M.2 Key B Interface (WS-23252)

    5G DONGLE Module, Quad Antennas, USB3.1 Port, Aluminum Alloy Heatsink, M.2 Key B Interface

    5G DONGLE MODULE
    M.2 TO USB 3.1 port

    Support SIMCom & Quectel 5G Module

    USB-TO-M.2-B-KEY-details-1.jpg
    Features At A Glance
    • Support 5G modules with M.2 (NGFF) Key B interface, compatible with SIMCom and Quectel 5G modules
    • Support 5G modules with 3042/3052 form factor, such as SIM82XX, and RM50XQ series 5G modules
    • USB 3.1 Type A port for connecting to PC, Raspberry Pi, or Jetson Nano host board to enable high speed 5G network
    • 4x SMA antenna connectors, easy to install the antenna
    • Onboard SIM card slot for NANO SIM card
    • Onboard power and network indicators, with multiple reserved pads, for checking module operating status and testing other functions
    • PCB ENIG process, reserved multi slots and positioning holes for integration
    • Comes with customized aluminum alloy heatsink, good heat dissipation, nice-looking, protective and durable

    Compatible With SIMCom / Quectel 5G Module
    SIM8202G-M2SIM8262E-M2RM500Q-GLRM500Q-AERM502Q-AE
    USB-TO-M.2-B-KEY-details-2-1.jpg USB-TO-M.2-B-KEY-details-2-2.jpg USB-TO-M.2-B-KEY-details-2-4.jpg USB-TO-M.2-B-KEY-details-2-6.jpg USB-TO-M.2-B-KEY-details-2-5.jpg
    Region / Provider China, US, Japan, South Korea, Europe, the Middle East, the Americas except Americas Global (except US) Global (except China)
    CHIP Qualcomm Snapdragon X55 Qualcomm Snapdragon X62 Qualcomm Snapdragon X55
    FREQUENCY BAND
    Sub-6G n1, n2, n3, n5, n7, n8, n12, n20, n28, n38, n40, n41, n66, n71, n77, n78, n79 n1, n3, n5, n7, n8, n20, n28, n38, n40, n41, n77, n78,n79 5G NR NSA: n41, n77, n78, n79 5G NR NSA: n1, n2, n3, n5, n7, n8, n12, n20, n25, n28, n38, n40, n41, n48, n66, n71, n77, n78, n79
    5G NR SA: n1, n2, n3, n5, n7, n8, n12, n20, n25, n28, n38, n40, n41, n48, n66, n71, n77, n78, n79
    LTE-FDD B1, B2, B3, B4, B5, B7, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B29, B30, B32, B66, B71 B1, B3, B5, B7, B8, B18, B19, B20, B26, B28, B32 B1, B2, B3, B4, B5, B7, B8, B12(B17), B13, B14, B18, B19, B20, B25, B26, B28, B29, B30, B32, B66, B71
    LTE-TDD B34, B38, B39, B40, B41, B42, B43, B48 B38, B39, B40, B41, B42, B43 B34, B38, B39, B40, B41, B42, B43, B48
    LAA - B46
    WCDMA B1, B2, B3, B4, B5, B8 B1, B5, B8 B1, B2, B3, B4, B5, B6, B8, B19
    GNSS GPS / GLONASS / BeiDou(Compass) / Galileo
    DATA RATE
    Sub-6G 2.4 Gbps (DL) / 500 Mbps (UL) 5G NR NSA: 
    2.1 Gbps (DL) / 900 Mbps (UL)
    5G NR NSA:
    2.1 Gbps (DL) / 450 Mbps (UL)
    5G NR NSA:
    4.2 Gbps (DL) / 450 Mbps (UL)
    5G NR SA:
    2.5 Gbps (DL) / 600/650 Mbps (UL)
    5G NR SA:
    2.5 Gbps (DL) / 650 Mbps (UL)
    5G NR SA:
    5.0 Gbps (DL) / 650 Mbps (UL)
    LTE 1 Gbps (DL)  /  200 Mbps (UL) 2.0 Gbps (DL) / 200 Mbps (UL)
    UMTS 42 Mbps (DL) / 5.76 Mbps (UL)
    SOFTWARE FUNCTIONS
    Operating systems Windows/Linux/Android
    Communication protocols TCP / UDP / FTP / HTTP / HTTPS / PING / SMS
    Dial Up RNDIS, NDIS, PPP, MBIM
    Firmware upgrade Supports firmware upgrade via USB port
    HARDWARE SPECIFICATIONS
    SIM Card 1.8V/2.95V
    Antenna For 3G/4G/5G/GNSS
    4 × IPEX-4 connectors
    Power Supply 3.135~4.4V 3.135 to 4.4 V, 3.7 V typical
    Form Factor M.2
    Dimensions 42.0 × 30.0 × 2.3mm 52.0 × 30.0 × 2.3mm
    Note: For reference only, 5G module is not included. If used with other modules, actual testing is required to confirm pin compatibility

    Multiple Size Compatibility

    Compatible With 3042 / 3052 Form Factor

    USB-TO-M.2-B-KEY-details-3.jpg
    Connection Examples

    Supports Directly Connect Or Access Via The USB Cable To Windows PC, Raspberry Pi 4B/3B+, 
    CM4-IO-BASE-A/B And Jetson Nano Series

    USB-TO-M.2-B-KEY-details-5.jpg
    USB-TO-M.2-B-KEY-details-7-1.jpg

    connecting with Raspberry Pi 4B 

     
    USB-TO-M.2-B-KEY-details-7-2.jpg

    Connect to PC with USB cable 

     
    USB-TO-M.2-B-KEY-details-7-3.jpg

    Connect to Jetson Nano

    for reference only, the modules in the pictures are not included.

    Multi System Support, Easy To Use

    Supports Windows/Linux

    Just plug it into USB port, go through some simple configuration, the high speed 5G network connection will be ready to use

    USB-TO-M.2-B-KEY-details-9.jpg
    Aluminum Alloy Heatsink

    Effective Heat Dissipation For 5G Module, Protect Your HAT At The Same Time

    USB-TO-M.2-B-KEY-details-13.jpg

    Outline Dimensions
    USB-TO-M.2-B-KEY-details-size.jpg
    Resources & Services
    res_banner.png

    Balenie Obsahuje / Package Content

    1. USB TO M.2 B KEY x 1
    2. Aluminum Alloy case (top and bottom) x 1
    3. Antenna x 4
    4. IPEX adapter cable x 1
    5. USB Type-A extension cable x 1
    6. SMA Protective Cap x 4
    7. Thermal tape x 1
    8. Screws pack x 1

    USB-TO-M.2-B-KEY-details-pack.jpg

    Waveshare Electronics
    WS-23252

    Specific References

    5G DONGLE Module, quad antennas, USB3.1 port, Aluminum Alloy Heatsink, M.2 Key B Interface (WS-23252)