RLX COMPONENTS s.r.o. , Electronic Components Distributor.
RLX COMPONENTS s.r.o. , Electronic Components Distributor.
Heat Sink for ODROID-C1+ / C0 (Hardkernel) 26x40mm
This heatsink might be useful for who needs the full throttled quad-core performance with ODROID-C0.
The same heatsink is mounted on ODROID-C1+ by default.
If you remove the thin(white) thermal interface material(TIM),
the heatsink might cause electric short to the PCB components.
- Dimension : 26.0 x 40.0 x 10.0 mm (approx.)
- Thermal interface material (double-side tape) is assembled.
Cautions!
1. Must remove a thin transparent film underneath before mounting on the PCB
2. Minimize stress/bending to the PCB when you mount/un-mount the cooler
This heatsink might be useful for who needs the full throttled quad-core performance with ODROID-C1.
Note that the thermal throttling doesn't happen in the most cases if the ambient temperature is lower than 35degree in Celsius.